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058)Michio Uneda, Mizuki Hatatani, Naoki Kubo, Kazutoshi Hotta and Hitoshi Morinaga: Visualization
   of slurry particle behavior using evanescent field during chemical mechanical polishing,
   Proceedings of International Conference on Planarization/CMP Technology 2022,
   (2022). (in Portland, USA)
057)Shunpei OTA, Michio UNEDA, Yuko YAMAMOTO, Tadakazu MIYASHITA and Ken-ichi ISHIKAWA:
   In-Situ Prediction of Removal Rate utilizing Neural Networks in Chemical Mechanical Polishing of
   Sapphireg, Proceedings of Asian Workshop on Planarization/ CMP Technology 2021, (2021)
   11-13.
056)Takaho MIYATA, Michio UNEDA, Kyosuke TENKOU, Kazutoshi HOTTA and Hitoshi MORINAGA:
   Visualization of tool behavior in three dimensional polishing: Relationship between removal
   amount distribution and tool behavior, Proceedings of The 23rd International Symposium on
   Advances in Abrasive Technology, (2021) 301-305.
055)Koji Fujii and Michio Uneda: Development of High Efficiency Polishing Method of SiC Substrate
   assisted by Nanobubbles Containing Ozone Gas, Proceedings of International Conference on
   Planarization/CMP Technology 2019, (2019) 171-172. (in Hsinchu, Taiwan)
054)Daichi Yoshisaki, Michio Uneda, Kazutaka Shibuya and Ken-ichi Ishikawa: Development of Intelligent
   Polishing System by Artificial Intelligence using Neural Network and Its Application, Proceedings of
   International Conference on Planarization/CMP Technology 2019, (2019) 149-150.
   (in Hsinchu, Taiwan)
053)Nodoka Yamada, Yoshihiro Tawara and Michio Uneda: Relationships among removal rate, friction
   coefficient and pad surface roughness in CMP of glass substrate using suede type polishing pad,
   Proceedings of International Conference on Planarization/CMP Technology 2019, (2019)
   151-152. (in Hsinchu, Taiwan)
052)Yutaro Arai, Takashi Fujita and Michio Uneda: Novel Pad Conditioning Technology by Ceramics Flexible
   Fiber Conditioner, Proceedings of International Conference on Planarization/CMP Technology 2019,
   (2019) 118-119. (in Hsinchu, Taiwan)
051)Masanori Fujimoto and Michio Uneda: Evaluation of dynamical behavior of slurry particle under
   electric field, Proceedings of International Conference on Planarization/CMP Technology 2018, (2018)
   318-321. (in Seoul, Korea)
050)Ryoishi Shiyama, Michio Uneda, Kazutoshi Hotta, Kazusei Tamai, Hitoshi Morinaga and Ken-ichi
   Ishikawa: Dynamic behavior analysis of magnetic clusters for three dimensional magnetic assisted
   polishing, Proceedings of International Conference on Planarization/CMP Technology 2018, (2018)
   314-317. (in Seoul, Korea)
049)Koji Fujii, Michio Uneda, Kazutaka Shibuya, Yoshio Nakamura, Daizo Ichikawa and Kenichi Ishikawa:
   High Efficient CMP Method of SiC by Enhanced Slurry Containing Nano-bubbles with Active Gas,
   Proceedings of International Conference on Planarization/CMP Technology 2018, (2018) 310-313.
   (in Seoul, Korea)
048)Kyo Oi, Michio Uneda and Ken-ichi Ishikawa: Visualization of hand-polishing process for Japanese
   swords - Mechanical properties of natural and artificial polishing stones and Kansei evaluation
   by craftsmen -, Proceedings of 12th International Symposium on Advanced Science and Technology
   in Experimental Mechanics, 104 (2017) 1-4. (in Kanazawa, Japan)
047)Shinya MIZUUCHI, Michio UNEDA, Kazutaka SHIBUYA, Yoshio NAKAMURA, Daizo ICHIKAWA and
   Ken-ichi Ishikawa: Chemical Mechanical Polishing of SiC Substrate Using Enhanced Slurry Containing
   Nanobubbles with Active Gas Generated by Plasma, Proceedings of International Conference on
   Planarization/CMP Technology 2017, (2017) 401-405. (in Leuven, Belgium)
046)Masanori FUJIMOTO and Michio UNEDA: Proposal of Spraying Pure Water Method under the Electric
   Field and Its Bahavior Observation in the Cleaning Process of CMP, Proceedings of International
   Conference on Planarization/CMP Technology 2017, (2017) 372-376. (in Leuven, Belgium)
045)Yuichi Tomiie, Michio Uneda, Kazutoshi Hotta, Kazusei Tamai, Hitoshi Morinaga and Ken-ichi Ishikawa:
   Effect of pad surface temperature and dry/ wet conditions on pad surface properties, Proceedings of
   International Conference on Planarization/CMP Technology 2015, (2015) 69-72. (in Arizona, USA)
   Scopus
   Web of Science
044)Takahiro Matsunaga, Michio Uneda, Yoshihiro Takahashi, Kazutaka Shibuya, Yoshio Nakamura,
   Daizo Ichikawa and Ken-ichi Ishikawa: Influence into Platen and Polishing Pad Surface Temperature on
   Removal Rate in Sapphire- Chemical Mechanical Polishing, Proceedings of International Conference on
   Planarization/CMP Technology 2015, (2015) 267-270. (in Arizona, USA)
   Scopus
   Web of Science
043)Michio Uneda, Keiichi Takano, Koji Koyama, Hideo Aida and Ken-ichi Ishikawa: Influence of Linear
   Velocity Ratio on Removal Rate of Sapphire- Chemical Mechanical Polishing, Proceedings of 2015
   JSME-IIP/ ASME-ISPS Joint Conference on Micromechatronics for Information and Precision
   Equipment (MIPE 2015), (2015) WeC-2-2. (in Kobe, Japan)
042)Yutaro Arai, Takashi Fujita, Naoki Takahashi and Michio Uneda: Long Life Mechanism on a Flexible
   Fiber Conditioner in CMP, Proceedings of International Conference on Planarization/CMP Technology
   2014, (2014) 162-167. (in Kobe, Japan)
   Scopus
   Web of Science
041)Michio Uneda, Yuya Fukuta, Yasuaki Itou, Kazutoshi Hotta, Kazusei Tamai, Hitoshi Morinaga and
   Ken-ichi Ishikawa: Influence of Slurry Flow Behavior on Material Removal Rate of Sapphire-Chemical
   Mechanical Polishing, Proceedings of the 15th International Conference on Precision Engineering,
   (2014) 281-282. (in Kanazawa, Japan)
040)Michio Uneda, Yuya Fukuta, Yasuaki Itou, Kazutoshi Hotta, Kazusei Tamai, Hitoshi Morinaga and
   Ken-ichi Ishikawa: Relationships Between Polishing Variables, Removal Rate and Slurry Flow in
   Sapphire-CMP, Proceedings of International Conference on Planarization/CMP Technology 2013,
   (2013) 277-280. (in Hsinchu, Taiwan)
039)Michio Uneda, Kiyomi Fujii and Ken-ichi Ishikawa: Processing Characteristics of Fixed Abrasive
   Mechanical Polishing Using Double-Sided Four-Way Machine, Proceedings of International Conference
   on Planarization/CMP Technology 2013, (2013) 264-267. (in Hsinchu, Taiwan)
038)Michio Uneda, Yoshihiro Takahashi, Kazutaka Shibuya, Yoshio Nakamura, Daizo Ichikawa and
   Ken-ichi Ishikawa: Relationships Between Removal Rate, Pad Surface Asperity and Polishing Head
   Vibration in Si-CMP, Proceedings of International Conference on Planarization/CMP Technology 2013,
   (2013) 214-217. (in Hsinchu, Taiwan)
037)Michio Uneda, Tatsunori Omote, Kazutaka Shibuya, Yoshio Nakamura, Daizo Ichikawa and Ken-ichi
   Ishikawa: Evaluation for In-Plane Micro Deformation Distribution Characteristics of Polishing Pad
   Surface Texture, Proceedings of Advanced Metallization Conference 2012 21st Asian Session
   (ADMETA PLUS 2012), (2012) 94-95. (in Tokyo, Japan)
036)Shinichi Iwamoto, Syuhei Kurokawa, Toshiro Doi, Michio Uneda, Osamu Ohnishi, Toshiyuki Suzuki,
   Yasuhiro Kawase and Ken Harada: Evaluation of surface damaged layer depth of Si wafer for TSV,
   Proceedings of Advanced Metallization Conference 2012 21st Asian Session (ADMETA PLUS 2012),
   (2012) 88-89. (in Tokyo, Japan)
035)Takateru Egashira, Toshiro Doi, Syuhei Kurokawa, Osamu Ohnishi, Michio Uneda, Isamu Koshiyama
   and Daizo Ichikawa: Characteristics of Sapphire CMP Under Various Gas Conditions Using Bell-Jar
   Type CMP Machine, Proceedings of Advanced Metallization Conference 2012 21st Asian Session
   (ADMETA PLUS 2012), (2012) 90-91. (in Tokyo, Japan)
034)Michio UNEDA, Yuya FUKUTA, Kazutoshi HOTTA, Hiroyasu SUGIYAMA, Hitoshi MORINAGA and
   Ken-ichi ISHIKAWA: A Novel Evaluation Method of Polishing Slurry Flow Using Digital Image
   Processing - Mechanical Polishing for Sapphire using Diamond Slurry -, Proceedings of International
   Conference on Planarization/CMP Technology 2012, (2012) 321-325. (in Grenoble, France)
033)Yu Moriwaki, Tsutomu Yamazaki, Toshiro K. Doi, Syuhei Kurokawa, Osamu Ohnishi, Michio Uneda
   and Kiyoshi Seshimo: Development of Novel Pad Groove Designs to Achieve High Efficiency CMP
   - 2nd Report: Friction Characteristic for Glass Polishing -, Proceedings of International Conference on
   Planarization/CMP Technology 2011, (2011) 494-497. (in Seoul, Korea)
032)Tsutomu Yamazaki, Toshiro K. Doi, Syuhei Kurokawa, Osamu Ohnishi, Michio Uneda, Yoji Umezaki,
   Kiyoshi Seshimo and Hideo Aida: Development of Novel Pad Groove Designs to Achieve High Efficiency
   CMP - 1st Report: Designing of Novel Groove Patterns Based on Image Analysis of Slurry Flow
   Behavior -, Proceedings of International Conference on Planarization/CMP Technology 2011,
   (2011) 490-493. (in Seoul, Korea)
031)Hiroshi Ikeda, Yoichi Akagami, Michio Uneda, Osamu Ohnishi, Syuhei Kurokawa and Toshiro K. Doi:
   The High-Efficiency Polishing Technology for Glass Substrates using Electrical Controlled Slurry
   Polishing, Proceedings of International Conference on Planarization/CMP Technology 2011, (2011)
   428-431. (in Seoul, Korea)
030)Hideo Aida, Hidetoshi Takeda, Seong-Woo Kim, Koji Koyama, Natsuko Aota, Tsutomu Yamazaki,
   Michio Uneda and Toshiro Doi: Bowing Control of Double-Side-Polished c-plane GaN Substrate,
   Proceedings of International Conference on Planarization/CMP Technology 2011, (2011) 416-419.
   (in Seoul, Korea)
029)Shinji Koga, Toshiro Doi, Syuhei Kurokawa, Osamu Ohnishi, Michio Uneda, Yoji Matsukawa,
   Keiji Matsuhiro and Tsutomu Yamazaki: Removal Mechanism of Oxide Single Crystal in Chemical
   Mechanical Polishing, Proceedings of International Conference on Planarization/CMP Technology 2011,
   (2011) 395-398. (in Seoul, Korea)
028)Michio UNEDA, Yuki MAEDA, Tatsunori OMOTE, Kazutaka SHIBUYA, Yoshio NAKAMURA,
   Koichiro ICHIKAWA, Ken-ichi ISHIKAWA, Toshiro DOI and Hideo AIDA: Relationship among Pad
   Conditioning Method, Cutting rate and Pad Surface Micro-Texture in CMP, Proceedings of ICPT2011,
   (2011) 236-239. (in Seoul, Korea)
027)Michio UNEDA, Tatsunori OMOTE, Yuki MAEDA, Kazutaka SHIBUYA, Yoshio NAKAMURA,
   Koichiro ICHIKAWA, Ken-ichi ISHIKAWA, Toshiro DOI and Hideo AIDA: Micro-Deformation Distribution
   Characteristics of CMP Pad at Conditioning Process in CMP - Relationship between Results of Micro-
   Deformation and Contact Image Analysis -, Proceedings of International Conference on
   Planarization/CMP Technology 2011, (2011) 232-235. (in Seoul, Korea)
026)Tao Yin, Toshiro Doi, Syuhei Kurokawa, Osamu Ohnishi, Tsutomu Yamazaki, Michio Uneda,
   Zhida Wang, Zhe Tan and Takateru Egashira: Processing Characteristics of SiC Wafer by Atmosphere-
   Controlled CMP Machine, Proceedings of International Conference on Planarization/CMP Technology
   2011, (2011) 165-168. (in Seoul, Korea)
025)Satoshi Yamaguchi, Toshiro Doi, Hiroyuki Kohno, Syuhei Kurokawa, Osamu Ohnishi, Michio Uneda
   and Yoji Matsukawa: Simplified method of evaluating scratches on the wafer polished by fumed silica
   slurry, Proceedings of International Conference on Planarization/CMP Technology 2011, (2011)
   62-65. (in Seoul, Korea)
024)Osamu Ohnishi, Toshiro Doi, Syuhei Kurokawa, Tsutomu Yamazaki, Michio Uneda, Kei Kitamura,
   Tao Yin, Isamu Koshiyama and Koichiro Ichikawa: CMP Characteristics of SiC Wafers Using a
   Simultaneous Double-side CMP Machine -Effects of Atmosphere and Ultraviolet Light Irradiation-,
   Proceedings of Advanced Metallization Conference 2011 21st Asian Session (ADMETA PLUS 2011),
   (2011) 110-111. (in Tokyo, Japan)
023)Tsutomu Yamazaki, Toshiro K. Doi, Syuhei Kurokawa, Michio Uneda, Osamu Ohnishi,Kiyoshi Seshimo
   and Yasunori Aso: Development of New Groove Patterns on CMP Pad -Slurry Flow Analysis using
   Digital Image Processing-, Proceedings of Advanced Metallization Conference 2011 21st Asian Session
   (ADMETA PLUS 2011), (2011) 112-113. (in Tokyo, Japan)
022)Michio Uneda, Tatsunori Omote, Ken-ichi Ishikawa, Toshiro Doi, Syuhei Kurokawa and Osamu Ohnishi:
   Performance Evaluation Method of CMP Pad Conditioner Using Digital Image Correlation (DIC)
   Processing, Proceedings of Advanced Metallization Conference 2011 21st Asian Session (ADMETA
   PLUS 2011), (2011) 114-115. (in Tokyo, Japan)
021)Michio UNEDA, Kenji OKABE, Norihiko MORIYA, Kazutaka SHIBUYA and Ken-ichi ISHIKAWA:
   Development of Evaluation Method for Geometric Characterization of Polishing Pad Surface Texture
   Based on Contact Image Analysis Using Image Rotation Prism - Relationship between Proposed
   Evaluation Parameters and Polishing Characteristics -, Proceedings of International Conference on
   Planarization/CMP Technology 2010, (2010) 360-363. (in Arizona, USA)
020)Michio UNEDA, Mikio TOSHIMA and Ken-ichi ISHIKAWA: Study on Accuracy Evaluation of Three-
   Dimensional Visualization Measurement using Near Field Stereo System Based on Digital Image
   Correlation Methodology, Proceedings of 5th International Symposium on Advanced Science and
   Technology in Experimental Mechanics, (2010) CD-ROM. (in Kyoto, Japan).
019)Michio UNEDA, Hiroaki KONDO, Yusuke MURAOKA and Ken-ichi ISHIKAWA: Experimental Study on
   Locations Estimation of High Correlation Sound Sources using Combined SSP and MUSIC Method,
   Proceedings of 5th International Symposium on Advanced Science and Technology in Experimental
   Mechanics, (2010) CD-ROM. (in Kyoto, Japan).
018)Michio UNEDA, Shintaro MURATA and Ken-ichi ISHIKAWA: Study on Quantitative Evaluation of Slurry
   Flow Mechanism at Lapping Processing using Digital Image Correlation Method - Correlation of Slurry
   Flow and Lapping Characteristics in Oscillation Controlled Lapping -, Proceedings of 5th International
   Symposium on Advanced Science and Technology in Experimental Mechanics, (2010) CD-ROM.
   (in Kyoto, Japan).
017)Michio UNEDA, Kenji OKABE, Norihiko MORIYA, Takumi KOBAYASHI, Kazutaka SHIBUYA and Ken-ichi
   ISHIKAWA: Development of Evaluation Method of Pad Surface Characteristics Based on Contact Image
   Analysis Using Image Rotation Prism, Proceedings of International Conference on Planarization/CMP
   Technology 2009 (2009) 483-488. (in Fukuoka, Japan)
016)Yoshinori TAKEI, Hiroyuki KAWAI, Michio UNEDA, Hideto NANTO, and S KOYAMA: Odor source
   localization for early fire detection by using MOS-type gas sensor array with infrared vision,
   Proceedings of PRiME 2008, (2008). (in Hawaii, USA)
   Scopus
015)Michio UNEDA, Setsuo IWATA, Koichiro TOMA, Masakatsu MATSUISHI, and Ken-ichi ISHIKAWA:
   Effect of Out-of-Plane Deformation on Strain Measurement using the Digital Image Correlation
   Method, Proceedings of ATEM'07, The Materials and Mechanics Division of the Japan society of
   Mechanical Engineers, (2007) OS9-1-2. (in Fukuoka, Japan)
014)Michio UNEDA, and Nobuaki FUJIKI: Consideration of Course Improvement Activities and Its Effect on
   Mechanical Designing and Drawing Project, Proceedings of FEDSM07, (2007) 1-5. (in San Diego, USA)
   Scopus
   Web of Science
013)Michio UNEDA, Hiromasa TSUKADA, Ken-ichi ISHIKAWA, and Hitoshi SUWABE: Studies on Slicing
   Characteristics of Vibratory OD-blade Slicing, Proceedings of ASPE 2006 Annual Meetings, American
   Society for Precision Engineering, (2006) CD-ROM. (in Monterey, California, USA)
   Scopus
012)Michio UNEDA, Ken-ichi ISHIKAWA, Hitoshi SUWABE, and Hiromasa TSUKADA: Studies on Oscillation
   Controlled Lapping using Small Diameter Lap Tool, Proceedings of ASPE 2006 Annual Meetings,
   American Society for Precision Engineering, (2006) CD-ROM. (in Monterey, California, USA)
   Scopus
011)Michio UNEDA, Ken-ichi ISHIKAWA, Hioshi SUWABE, and Hiromasa TSUKADA: Development of
   Vibratory OD-blade Slicing using Mechanical Elliptical Vibration Spindle -Vibration Slicing Principle
   and Basic Slicing Characteristics-, Proceedings of International Conference on Leading Edge
   Manufacturing in 21st Century, (2005) 625-629. (in Nagoya, Japan)
   Scopus
010)Michio UNEDA, and Ken-ichi ISHIKAWA: A Study on Basic Performance Comparison with Acoustic
   Holography and MUSIC Methods in Sound Source Identification, Proceedings of The First International
   Symposium on Advanced Technology of Vibration and Sound, (2005) 64-68. (in Miyajima, Japan)
009)Michio UNEDA, Hitoshi SUWABE, and Ken-ichi ISHIKAWA: Grinding Simulation with Diamond Pellets
   and Optimization of Its Grinding Conditions, Proceedings of ASPE 2004 Annual Meetings, American
   Society for Precision Engineering, (2004) CD-ROM. (in Orland, Florida, USA)
008)Michio UNEDA, and Ken-ichi ISHIKAWA: Location Finding Characteristics of Spread Sound Sources
   by means of MUSIC Algorithm, Proceedings of ICA 2004, International Congress on Acoustics, (2004)
   751-754. (in Kyoto, Japan)
007)Michio UNEDA, and Ken-ichi ISHIKAWA: A Proposal of the MUSIC Algorithm for Short Range Signal
   Sources and the Application for the Location Finding, Proceedings of ATEM'03, The Materials and
   Mechanics Division of the Japan society of Mechanical Engineers, (2003) CD-ROM (GSW0132).
   (in Nagoya, Japan)
006)Michio UNEDA, Hirokazu HOKAZONO: DOA Estimation Characteristics of the MUSIC Algorithm for
   the Actual Extended Targets of the Chirp Pulse Tracking Radar, Proceedings of IEEE Radar
   Conference 2002, IEEE, (2002) CD-ROM. (in Long Beach, California, USA)
   Scopus
   Web of Science
005)Ken-ichi ISHIKAWA, Hitoshi SUWABE, and Michio UNEDA: Study on Vibration OD-Blade Slicing with
   Air-Mist Working fluid for Environment -Effect of Applied Vibration Amplitude on Slicing
   Characteristics-, Proceedings of ASPE 1999 Annual Meetings, American Society for Precision
   Engineering, (1999) 489-492. (in Monterey, California, USA)
   Web of Science
004)Ken-ichi ISHIKAWA, Hitoshi SUWABE, and Michio UNEDA: Vibration Cutting Method of OD-Blade With
   Atomized Working Fluid, Proceedings of ASPE 1998 Annual Meetings, American Society for Precision
   Engineering, (1998) 80-83. (in St. Louis, Missouri, USA)
   Web of Science
003)Ken-ichi ISHIKAWA, Hitoshi SUWABE, and Michio UNEDA: Vibration Effect on Cutting Characteristics
   Using OD-Blade -Theoretical Consideration of Cutting Mechanism-, Proceedings of 9th International
   Precision Engineering Seminar and 4th International Conference on Ultraprecision in Manufacturing
   Engineering, 2 (1997) 554-557. (in Braunschweig, Germany)
002)Hitoshi SUWABE, Ken-ichi ISHIKAWA, and Michio UNEDA: Effect of Vibration using Ultrasonic and
   Low Frequency Vibrations on Grooving Process for Hard and Brittle Materials, Proceedings of ASPE
   1996 Annual Meetings, American Society for Precision Engineering, (1996) 542-545.
   (in Monterey, California, USA)
001)Ken-ichi ISHIKAWA, Hitoshi SUWABE, and Michio UNEDA: Development of Vibration Cutting using
   OD-Blade, Proceedings of ASPE 1996 Annual Meetings, American Society for Precision Engineering,
   (1996) 572-577. (in Monterey, California, USA)

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